Publikationsansicht

Heterogeneous integration: From substrate technology to active packaging (2001)

Abstract
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Details der Publikation
Download http://digital.library.wisc.edu/1793/10620
http://dx.doi.org/10.1109/IEDM.2001.979465
Herausgeber Institute of Electrical and Electronics Engineers Inc
Archiv MINDS @ UW (United States)
Verknüpfungen http://www.ieee.org/
http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000245