Publikationsansicht

Joining of thin glass with semiconductors by ultra-fast high-repetition laser welding (2008)

Details der Publikation

Archiv	Fraunhofer Publica (Germany)
Typ	Conference Paper
Sprache	english
Verknüpfungen	Pfleging, W.: Laser-based micro- and nanopackaging and assembly II: 22 - 24 January 2008, San Jose, California, USA. Bellingham, WA: SPIE, 2008. (SPIE Proceedings Series 6880), Paper 68800A