| , D. Scott Wills (2007) | |||||||||||||||
Abstract | |||||||||||||||
| Introduction Integrated optoelectronic interconnect offers a potentially lower cost, higher density alternative to wire-based technologies for I/O. For most applications, low cost IC packages provide an effective means of I/O in a system. However, some applications, such as image processing, require higher levels of off-chip I/O bandwidth than can be provided using perimeter bonded ICs. The SIMD Pixel Processor (SIMPil) is a new image processing architecture that takes advantage of integrated optoelectronics to form a lightweight, high frame rate smart camera. To achieve high frame rates while maintaining adequate resolution, the SIMPil system consists of an array of SIMD nodes integrated with an array of optoelectronic detectors. This integration allows for a compact and lightweight system. However, such a system will require a high power level resulting in a short battery life and possible thermal problems. Plausible low power opportunities for the SIMPil system are presented using | |||||||||||||||
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