Publikationsansicht

Hybrid flip-chip integration of a 40 Gb/s DPSK receiver comprising a balanced photodetector on a DLI-SOI board (2008)

Abstract
A DPSK receiver concept using flipchip hybrid integration of InP photodetectors on SOI boards with optical decoder is presented. Horizontal waveguiding enables low-cost production for high data rates.

Details der Publikation
Archiv Fraunhofer Publica (Germany)
Typ Conference Paper
Sprache english
Verknüpfungen Institute of Electrical and Electronics Engineers -IEEE-: 2008 34th European Conference on Optical Communication, ECOC 2008. Conference Proceedings: Brussels, Belgium, 21-25 September 2008. Piscataway, NJ: IEEE, 2008, 2 pp.