C. Drevon

Details der Publikationsliste

Zeitraum

1992 - 2006

Anzahl

14

Co-Autoren

Multilayer RF PCB for space applications : technological and interconnections trade-off (2005)

Paillard, M., Bodereau, F., Drevon, C., Monfraix, P., Cazaux, Jean-Louis, Bodin, L., ...

Multilayer RF Printed Circuits Boards withembedded passives are complex structures to manufactureand to package while keeping good RF performances. In thispaper, technological solutions aimed at...

Optimised thermal and microwave packaging for wide-band gap transistors : diamond & flip chip (2005)

Schaffauser, C., Vendier, O., Forestier, S., Michard, F., Geffroy, D., Drevon, C., ...

Wide-band gap (WBG) transistors give a real breakthrough for power devices compared to Silicon (Si) and Gallium Arsenide (GaAs) components. However, for space applications, the high power density of...

Main achievements to date toward the use of RF MEMS into space satellite payloads (2005)

Vendier, O., Paillard, M., Legay, H., Schaffauser, C., Forrestier, S., Caille, G., ...

MEMS (Microelectromechanical Systems) technology plays a key role in the on-going miniaturization of electronic modules for automotive and consumer electronic products. In the microwave field, RF...

3D packaging for space application : imagination and reality (2005)

Monfraix, Philippe, Drevon, C., Schaffauser, Chloé, Paillard, Mathieu, Vendier, Olivier, Cazaux, Jean-Louis

This paper describes theALCATELexperience on the design, manufacturingandmeasurementof microwave and digital modules based on 3D packagingapproach.Even if that appears as a very futuristic...

New Trends for Microwave Packaging into Space-Borne Equipment (2002)

Drevon, C., Monfraix, Philippe, Paillard, Mathieu, Schaffauser, Chloé, Vendier, Olivier, Cazaux, Jean-Louis

This paper focuses on the most promising evolutions which are emerging in the packaging of microwave functions for space applications. Starting from the former micropackage solution, continuing with...

Microwave glob top for space applications : A route to non hermiticity (2001)

Monfraix, P., Albo, L., Drevon, C., Cazaux, Jean-Louis, Roux, J.L.

This paper presents the electrical design, measurement and reliability tests of an encapsulated MMIC using a dam & fill technique. Materials, dispensing techniques, RF design are evaluated. Test...

Flip-chip for space applications : Bonding reliability, DC and RF results. (2000)

George, Sebastien, Drevon, C., Cazaux, Jean-Louis

This paper presents a study of flip-chip bonding for space applications. DC and mechanical test vehicles have demonstrated the reliability of the flip-chip gold-gold thermocompression bonding up to...

Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging (2000)

Monfraix, P., Adam, T., Lacoste, J.L., Drevon, C., Naudy, G., Cogo, B., ...

This paper presents the electrical design, measurement and reliability ests of a shielded vertical interconnection dedicated to microwave solder-mount packages. Electromagnetic simulations show very...

From full hybrid to 3D microwave packaging for space applications (1999)

Drevon, C., Cazaux, Jean-Louis

Over recent years, the miniaturisation of microwave functions was based on the use of hybrid technology. That included thin or thick film capability, micro or macro microwave packages and the design...

3D active modules for high integration active antennas (1998)

Ulian, Patrice, Monfraix, Philippe, George, Sebastien, Tronche, Christian, Drevon, C., Cazaux, Jean-Louis

This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly...

GaAs MMIC die assembly (1992)

Lautier, P., Drevon, C., Coello Vera, A.

The widespread use of GaAs MMICs in microwave systems require assembly technologies with high yields and high reliability, while preserving the intrinsic performance of the die. This is a difficult...

Inactivation of a transfected gene in human fibroblasts can occur by deletion, amplification, phenotypic switching, or methylation.

Gebara, M M, Drevon, C, Harcourt, S A, Steingrimsdottir, H, James, M R, Burke, J F, ...

Plasmids containing the bacterial gpt gene under control of the simian virus 40 promoter were transfected into a simian virus 40-transformed human fibroblast line. Two transfectants, E2 and C10,...

Inactivation of a transfected gene in human fibroblasts can occur by deletion, amplification, phenotypic switching, or methylation.

Gebara, M M, Drevon, C, Harcourt, S A, Steingrimsdottir, H, James, M R, Burke, J F, ...

Plasmids containing the bacterial gpt gene under control of the simian virus 40 promoter were transfected into a simian virus 40-transformed human fibroblast line. Two transfectants, E2 and C10,...