Evidence for a layer-dependent Ehrlich-Schwöbel barrier in organic thin film growth (2009)
Zhang, X. N., Barrena, E., Goswami, D., De Oteyza, D. G., Weis, C., Dosch, H.
Thin Films Division (DS) Overview Invited Talks Thin Films Division (2008)
Dünne Schichten (ds, Molecules •h. Wende, M. Bernien, J. Luo, C. Weis, ...
DS 1.2 Mon 10:00–10:30 H 2013 Organic spintronics: can theory play a role? — •Stefano Sanvito DS 1.3 Mon 10:30–11:00 H 2013 Spintronic and electro-mechanical effects in single-molecule...
Foscante, R. E., Wiegand, W., Weis, C., Gilbert, H., Comfort, T.
An extensive series of organometallic compounds and metal carboxylates are being screened to determine their utility as catalysts for the ambient temperature cure of carboxylic acid-epoxide binders....
Ambient Temperature Cure Catalysts for Carboxy Binder Systems. (2005)
Foscante, R., Weis, C., Wiegand, W., Gilbert, H., Comfort, T.
Propellants based on carboxylic acid-epoxide and carboxylic acid-aziridine binder systems and containing up to 85.5% solids (AP, Al) can be mixed, cast, and cured completely and successfully at 25 +...
Verfahren und Vorrichtung zur online Materialschichtdickenbestimmung (2004)
DE 10313888 A UPAB: 20041125 NOVELTY - Method for continuous online measurement and regulation of the thickness of coating material deposited on a workpiece surface in which an optical measurement...
Verfahren und Vorrichtung zum Handhaben und Positionieren von Objekten (2004)
DE 10313890 A UPAB: 20041203 NOVELTY - The method of handling articles (3) uses a manipulator (1) to receive the articles via two jaws (2). It involves receiving an article in the jaws to grip it via...
Weis, C., Merdes, M., Adrian, J.
DE 10301423 A UPAB: 20040826 NOVELTY - The ultrasonic welding assembly has a sonotrode (4) on a stack (1). A holder (7) is opposite the stack with a component holder to take the component (6) for...
Weis, C., Merdes, M., Adrian, J.
DE 10301433 A UPAB: 20040915 NOVELTY - The ultrasonic welding assembly (1) has a sonotrode (5) mounted at a stack (2), and a facing holder (7) to take the workpiece holder (16) with the workpiece...
System und Verfahren zur Herstellung von Mikrobauteilen (2004)
DE 10302771 A UPAB: 20040901 NOVELTY - Control electronics on a casing (713) link to a computer. A micro-gripper (MG) (1) and a nano-positioning system (4) i.e. a piezoelectric hexapod can move with...
Die intelligenten Werkzeuge (2004)
Im Rahmen der Entwicklung der "Intelligenten Werkzeuge" wurden mikroelektronische Komponenten in ein Schraub-, Greif- und Dispensmodul integriert. Diese Komponenten umfassen Sensoren zur...
Intelligente Roboterwerkzeuge für Fügeprozesse (2004)
Schraft, R.D., Weis, C., Wiedenhöfer, M.
In the framework of the development of intelligent joining-tools for industrial robots, microelectronic components are integrated on a screwdriver-module, on a gripper-module and on a...
Building a mini-factory from a technology construction kit (2002)
Gaugel, T., Dobler, H., Bengel, M., Weis, C., Schließer, J.
Microsystem technology and miniaturization are becoming more and more important in the automotive industry, investment goods industry, communications technology, medical device technology and in the...
Guo, T.L., Chi, R.P., Zhang, X.L., Musgrove, D. L., Weis, C., Germolec, D. R., ...
To further determine whether genistein (GEN) modulation of the immune responses was related to its endocrine-disrupting properties and time of exposure, pregnant C57BL/6 mice were exposed to GEN at...