A ThreeDimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect (1995)
D. Scott Wills, W. Stephen Lacy, Christophe Camperi-ginestet, Brent Buchanan, Huy H. Cat, Scott Wilkinson, ...
Abstract-This paper presents a three-dimensional, highly par-allel, optically interconnected system to process high-throughput stream data such as images. The vertical optical interconnections are...