Georgianna Dagnall

A Three-Layer 3-D Silicon System Using Through-Si Vertical Optical Interconnections and Si CMOS Hybrid Building Blocks (2008)

Steven W. Bond, Olivier Vendier, Myunghee Lee, Sungyong Jung, Georgianna Dagnall, Martin Brooke, ...

Abstract — We present for the first time a three-dimensional (3-D) Si CMOS interconnection system consisting of three layers of optically interconnected hybrid integrated Si CMOS transceivers. The...