Recent developments in rear-surface passivation at Fraunhofer ISE (2009)
Hofmann, M., Janz, S., Schmidt, C., Kambor, S., Suwito, D., Kohn, N., ...
Fraunhofer ISE has a long experience in the field of surface passivation for crystalline silicon wafers. Novel rear-surface passivation layer systems have led to excellent results. Using a...
M. Hofmann, S. Kambor, C. Schmidt, D. Grambole, J. Rentsch, S. W. Glunz, ...
A novel plasma-enhanced chemical vapour deposited (PECVD) stack layer system consisting of a-SiOx:H, a-SiNx:H, and a-SiOx:H is presented for silicon solar cell rear side passivation. Surface...
Hofmann, M., Schmidt, C., Kohn, N., Rentsch, J., Glunz, S.W., Preu, R.
A stack of hydrogenated amorphous silicon (a-Si) and PECVD-silicon oxide (SiOx) has been used as surface passivation layer for silicon wafer surfaces. Very good surface passivation could be reached...
M. Hofmann, S. Kambor, C. Schmidt, D. Grambole, J. Rentsch, S. W. Glunz, ...
A novel plasma-enhanced chemical vapour deposited (PECVD) stack layer system consisting of a-SiOx:H, a-SiNx:H, and a-SiOx:H is presented for silicon solar cell rear side passivation. Surface...
Pilot-line processing of very large (21 x 21 cm²) and thin mc-Si solar cells (2007)
Clement, F., Preu, R., Reis, I.E., Biro, D., Rentsch, J., Zimme, M., ...
Firing stable surface passivation using all-PECVD stacks of SiOx:H and SiNx:H (2007)
Hofmann, M., Kambor, S., Schmidt, C., Grambole, D., Rentsch, J., Glunz, S.W., ...
Industrial realization of dry plasma etching for PSG removal and rear side emitter etching (2007)
Rentsch, J., Decker, D., Hofmann, M., Schlemm, H., Roth, K., Preu, R.
Textur- und Reinigungsmedium zur Oberflaechenbehandlung von Wafern und dessen Verwendung (2007)
Mayer, K., Schumann, M., Kray, D., Orellana Peres, T., Rentsch, J., Zimmer, M., ...
DE 102007058829 A1 UPAB: 20090619 NOVELTY - A water-based texture- and cleaning agent is employed to treat the surface mono-crystalline wafers. The agent incorporates one or more alkaline etching...
Verfahren und Vorrichtung zur Bearbeitung von Waferoberflaechen (2007)
Mayer, K., Schumann, M., Kray, D., Orellana Peres, T., Rentsch, J., Zimmer, M.
DE 102007058876 A1 UPAB: 20090619 NOVELTY - Method for processing wafer surfaces comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a...
Biro, D., Preu, R., Glunz, S., Rein, S., Rentsch, J., Emanuel, G., ...
PECVD PSG as a dopant source for industrial solar cells (2006)
Benick, J., Rentsch, J., Schetter, C., Voyer, C., Biro, D., Preu, R.
Experimental investigation of wire sawing thin multicrystalline wafers (2006)
Kray, D., Schumann, M., Schultz, O., Bergmann, M., Ettle, P., Rentsch, J., ...
Technology route towards industrial application of rear passivated silicon solar cells (2006)
Rentsch, J., Schultz, O., Grohe, A., Biro, D., Preu, R., Willeke, G.
The status of silicon solar cell production technology development at Fraunhofer ISE (2006)
Preu, R., Biro, D., Rentsch, J., Emanuel, G., Grohe, A., Hofmann, M.
Biro, D., Preu, R., Rentsch, J.
WO 2008028625 A2 UPAB: 20080417 NOVELTY - The method involves coating a surface area of a semiconductor substrate with a layer (3) of doping material, which comprises amorphous silicon, silicon...
Biro, D., Preu, R., Glunz, S., Rein, S., Rentsch, J., Emanuel, G., ...
PECVD PSG as a dopant source for industrial solar cells (2006)
Benick, J., Rentsch, J., Schetter, C., Voyer, C., Biro, D., Preu, R.
Isotropic plasma texturing of mc-Si for industrial solar cell fabrication (2005)
Rentsch, J., Kohn, N., Bamberg, F., Roth, K., Peters, S., Ludemann, R., ...
Verfahren zur Verminderung der Reflexion an Halbleiteroberflaechen (2005)
Schneiderloechner, E., Rentsch, J., Preu, R.
DE 10352423 B UPAB: 20050124 NOVELTY - Process for reducing the reflection on semiconductor surfaces comprises subjecting one or more regions to dry chemical etching, in which the aspect ratio of...
Detection and traceability of genetically modified organisms in the food production chain (2004)
Miraglia, M., Berdal, K.G., Brera, C., Corbisier, P., Kok, E.J., ...
Both labelling and traceability of genetically modified organisms are current issues that are considered in trade and regulation. Currently, labelling of genetically modified foods containing...
Jaus, J., Rosen, J., Willeke, G., Preu, R., Rentsch, J.
Diplomarbeit an der Universiät Karlsruhe (Technische Hochschule), Fachbereich Wirtschaftswissenschaften, Institut für Industriebetriebslehre und Industrielle Produktion. Angefertigt am...
Screen-printed epitaxial silicon thin-film solar cells with 13.8% efficiency (2003)
Rentsch, J., Bau, S., Huljic, D.M.
Amidst the different silicon thin-film systems, the epitaxial thin-film solar cell represents an approach with interesting potential. Consisting of a thin active c-Si layer grown epitaxially on top...
Screen printed c-Si thin film solar cells on insulating substrates (2003)
Rentsch, J., Huljic, D.M., Kieliba, T., Bilyalov, R., Reber, S.
Plasma etching for industrial in-line processing of c-Si solar cells (2003)
Rentsch, J., Emanuel, G., Schetter, C., Aumann, T., Theirich, D., Gentischer, J., ...
Technology path to the industrial production of highly efficient and thin c-Si solar cells (2003)
Preu, R., Biro, D., Emanuel, G., Grohe, A., Hofmann, M., Huljic, D.M., ...
Application of screen-printing processes for epitaxial silicon thin-film solar cells (2003)
Bau, S., Rentsch, J., Huljic, D.M., Reber, S., Hurrle, A., Willeke, G.
Shunt-Analysis of Epitaxial Silicon Thin-Film Solar Cells by Lock-In Thermography (2002)
Bau, S., Huljic, D. M., Isenberg, W., Rentsch, J.
Lock-in thermography has been applied for shuntanalysis on epitaxial silicon thin-film solar cells. The solar cell material was made by epitaxial deposition of the base layer on highly doped...