Thermal modeling and management in ultrathin chip stack technology (2002)
Pinel, Stèphane, Marty, Antoine, Tasselli, Josiane, Bailbe, Jean-Pierre, Beyne, Eric, Van Hoof, Rita, ...
This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process. Besides the high concentration of power dissipating sources, which is the...