Modeling, simulation and calibration of the chip encapsulation molding process (2009)
Roellig, M., Meyer, S., Thiele, M., Rzepka, S., Wolter, K.J.
The transient process of filling the mold cavity in microelectronics packaging has been simulated applying the finite element method (FEM). The results have been compared to those of so-called 'short...
Plasma treatment for fluxless soldering (2001)
Deltschew, R., Hirsch, D., Neumann, H., Herzog, T., Wolter, K.J., Nowottnick, M., ...
Plasma treatment of printed circuit boards (PCB) with solid solder deposits (SSD) makes it possible to eliminate the application of conventional flux in reflow soldering process. This work deals with...