Hyoung-soo Ko, J. S. Kim, H. G. Yoon, S. Y. Jang, S. D. Cho, K. W. Paik
A novel design of three dimensional (3-D) memory die stack package has been established. And the prototype of the 3-D package using mechanical dies has been demonstrated. The whole processes of...
Kim, H.J., Chung, C.K., Kwon, Y.M., Yim, M.J., Hong, S.M., Jang, S.Y., ...
The formation of process-related bubbles that become entrapped inside the anisotropic conductive film (ACF) layer during bonding processes remains an issue. The formation of these bubbles is strongly...
An accurate characterization for the deformation behavior of conductive particles is important: 1) to understand the anisotropic conductive adhesive (ACA) interconnection and 2) to optimize the ACA...
Cho, M.G., Paik, K.W., Lee, H.M., Booh, S.W., Kim, T.G.
The interfacial reaction between 42Sn-58Bi solder (in wt.% unless specified otherwise) and electroless Ni-P/immersion Au was investigated before and after thermal aging, with a focus on the formation...
Chip warpage damage model for ACA film type electronic packages (2005)
Yang, S.Y., Kwon, W.S., Lee, S.B., Paik, K.W.
The use of anisotropically conductive adhesives (ACA) for the direct interconnection of flipped silicon chips to printed circuits (flip chip packaging), offers numerous advantages such as reduced...
Kwon, W.S., Yim, M.J., Paik, K.W., Ham, S.J., Lee, S.B.
One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling...
Kwon, W.S., Yang, S.Y., Lee, S.B., Paik, K.W.
The important mechanical mechanism for the electrical conduction of anisotropic conductive films (ACFs) is the joint clamping force after curing and cooling-down processes of ACFs. In this study, the...
Jeon, Y.D., Paik, K.W., Ostmann, A., Reichl, H.
Using the screen-printed solder-bumping technique on the electroless plated Ni-P under-bump metallurgy (UBM) is potentially a good method because of cost effectiveness. As SnAgCu Pb-free solders...
Microwave Frequency Model of FPBGA Solder Ball Extracted from S-Parameters Measurement (2004)
Lee, J.H., Ahn, S.Y., Kwon, W.S., Kim, J.H., Paik, K.w.
First we introduce the high-frequency equivalent circuit model of the Fine Pitched Ball Grid Array (FPBGA) bonding for frequencies up to 20 GHz. The lumped circuit model of the FPBGA bonding was...
This paper presents the thermal and mechanical contribution of anisotropic conductive films (ACFs) to the electrical conduction establishment of ACF joint. The conduction mechanism of ACF joint...
Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film (2004)
Yim, M.J., Hwang, Jin Sang, Kim, Jin Gu, Ahn, Jin Yong, Kim, Hyoung Joon, Kwon, Woonseong, ...
Anisotropic conductive film (ACF) has been used as interconnect material for flat-panel display module packages, such as liquid crystal displays (LCDs) in the technologies of tape automated bonding...
Nah, J.W., Paik, K.W., Suh, J.O., Tu, K.N.
The electromigration-induced failure in the composite solder joints consisting of 97Pb–3Sn on the chip side and 37Pb–63Sn on the substrate side was studied. The under-bump metallization ~UBM! on...
Effects of Cu/Al Intermetallic Compound (IMC) on Copper Wire and Aluminum Pad Bondability (2003)
Kim, H.J., Lee, J.Y., Paik, K.W., Koh, K.W., Won, J,H,, Choi, J.H., ...
Copper wire bonding is an alternative interconnection technology that serves as a viable, and cost saving alternative to gold wire bonding. Its excellent mechanical and electrical characteristics...
Yim, M.J., Jung, I.H., Kim, K.J., Choi, H.K., Hwang, J.S., Kim, J.G., ...
Anisotropic conductive adhesives have been considered and evaluated as promising interconnect materials for flip chip assembly in the applications for low cost, high-density and high speed...
Jang, S.Y., Wolf, J., Ehrmann, O., Gloor, H., Reichl, H., Paik, K.W.
Abstract—Electroplating solder bumping process offers fine pitch, highly reliable, and cost effective advantages for flip-chip technology. In this technology, under bump metallization (UBM) is...
Jang, S.Y., Wolf, J., Ehrmann, O., Gloor, H., Schreiber, T., Reichl, H., ...
The electroplating solder bumping process offers fine pitch, high reliability, and cost effective advantages for flip-chip technology. In this technology, under bump metallization (UBM) is required...
Investigation of Flip Chip Under Bump Metallization Systems of Cu Pads (2002)
Abstract—In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the...
Stresses in Electroless Ni-P Films for Electronic Packaging Applications (2002)
Electroless-plated nickel films for electronic packaging applications such as under bump metallurgy (UBM) and flip chip bumps are investigated in this study. Quantitative stress of an...
Grain Morphology of Intermetallic Compounds at Solder Joints, (2002)
Choi, W.K., Jang, S.Y., Paik, K.W., Kim, J.H., Lee, H.M.
The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu6Sn5 grains on Cu substrates...
Under bump metallurgy study for Pb-free bumping (2002)
Jang, Se Young, Wolf, Juergen, Gloor, Heinz, Paik, K.W.
The demand for Pb-free and high-density interconnection technology is rapidly growing. The electroplating-bumping method is a good approach to meet finepitch requirements, especially for high-volume...
Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study (2002)
Jang, S.Y., Wolf, J., Ehrmann, O., Reichl, H., Paik, K.W.
This paper describes newly defined eutectic SnAg solder bumping process using an alloy electroplating method and the interface reactions between four different types of UBM (under bump metallurgy)...
Under bump metallurgy study for Pb-free bumping (2002)
Jang, S.Y., Wolf, J., Paik, K.W.
The demand for Pb-free and high-density interconnection technology is rapidly growing. The electroplating-bumping method is a good approach to meet fine-pitch requirements, especially for high-volume...
Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM) (2002)
Jang, S.Y., Wolf, J., Ehrmann, O., Gloor, H., Reichl, H., Paik, K.W.
Pb-free solder is one of the biggest issues in today's electronic packaging industry. This paper introduces a newly developed Sn/3.5Ag alloy plating process For wafer level bumping. The effects of...
Comparison of Electroplated Eutectic Bi/Sn and Pb/Sn Solder Bumps on Various UBM Systems (2001)
The effect of a reflow process and under bump metallurgy (UBM) systems on the growth of intermetallic compounds (IMC) of the 57Bi/43Sn and 37Pb/63Sn solder bump/UBM interfaces was investigated. The...
Al-chelate coupling agent was successfully applied to improve the adhesion strength of a thermoplastic polyetherimide resin, Ultem 1000® to a silicon wafer during the fabrication of multichip module...
Investigation of Low Cost Flip Chip Under Bump Metallization (UBM) Systems on Cu Pads (2001)
Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the...
Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder (2001)
Jang, S.Y., Wolf, Juergen, Ehrmann, Oswin, Gloor, Heinz, Reichl, Herbert, Paik, K.W.
This paper describs newly defined eutectic SnAg solder bumping process using an alloy electroplating method and the interface reactions between four different types of UBM (Under Bump Metallurgy)...
Although integral capacitors fabricated using polymer/ceramic composite film have been intensively investigated, there was no systematic study of relationships between suspension formulation and...
In this paper, we investigated the effect of nonconducting fillers on the thermomechanical properties of modified anisotropic conductive adhesive (ACA) composite materials and the reliability of flip...
Ryu, W.H., Yim, M.J., Ahn, S.Y., Lee, J.H., Kim, W.P., Paik, K.W., ...
This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process is based on an optimization procedure, called a genetic...
Ko, H.S., Kim, J.S., Yoon, H.G., Jang, S.Y., Cho, S.D., Paik, K.W.
A newly designed three dimensional (3-D) memory die stack package has been established, and the prototype of the 3-D package using mechanical dies has been successfully demonstrated. Fabrication...
A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer (2000)
Lim, J.H., Kim., J.S., Paik, K.W., Earmme, Y.Y.
A multichip module (MCM) substrate is an example of multilayer structure under thermal loading. In MCM-D substrate, various thin film technologies are used and the number of layers increases to meet...
Kim, J.S., Paik, K.W., Kim, B.K., Lim, J.H.
The thermomechanical behavior of multilayer structures is a subject of perennial interest. Among various multilayer structures, we provided a thorough investigation on the lamination-based thick-film...
Yim, M.J., Jeon, Y.D., Paik, K.W.
Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances, resulting in a high performance and cost-competitive packaging...
Kim, Jin S., Paik, K.W., Oh, Seong H.
The thermomechanical behavior of multilayer structures is a subject of perennial interest. Stoney’s formula has long been one of the most important tools for understanding thermomechanical stress...
Kim, K.H., Park, J.M., Kim, C.K., Hofman, G.L., Paik, K.W.
The interaction between atomized U3Si2 and aluminum in dispersion fuel samples has been characterized and compared with that of comminuted U3Si2. Fuel samples with atomized powder showed a smaller...
Ko, H.S., Kim, J.S., Yoon, H.G., Jang, S.Y., Cho, S.D., Paik, K.W.
A novel design of three dimensional (3-D) memory die stack package has been established. And the prototype of the 3-1) package using mechanical dies has been demonstrated. The whole processes of...
Thermomechanical stress analysis of laminated thick-film multilayer substrates (1999)
Kim, J.S., Paik, K.W., Lim, J.H., Earmme, Y.Y.
As an increasing number of polymer dielectric layers were laminated, the maximum bow values were measured layer by layer using a laser profilometry during thermal cycling. In the lamination process,...
Yim, M.J., Ryu, W.H., Jeon, Y.D., Kim, J.H., Paik, K.W.
Microwave model and high-frequency measurement of the ACF flip-chip interconnection is investigated using a microwave network analysis. The test IC was fabricated using a 1-poly and 3-metal 0.6 pm Si...
The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF) (1999)
The effect of bonding pressure on the electrical and mechanical properties of anisotropic conductive film (ACF) joint using nickel particles and metal-coated polymer ball-filled ACF’s was...
Tantalum oxide (Ta2O5) thin film capacitors for multichip module (MCM) applications were investigated. Through the capacitor characterization and RBS compositional analysis, it was found that when...
Ko, H.S., Paik, K.W., Park, L.J., Kim, Y.G., Tundermann, J.H.
The influence of a 3 wt% Re addition on the creep strength and microstructure of a mechanically alloyed and oxide dispersion-strengthened nickel-base superalloy was investigated. Two alloys,...
Thermal Compatibility of Centrifugally Atomized U-Mo Powders with Al in a Dispersion Fuel (1997)
Kim, K.H., Lee, D.B., Kim, C.K., Hofman, G.L., Paik, K.W.
The thermal compatibility of centrifugally atomized U–Mo alloys with aluminum has been studied. Samples of extruded dispersions of 24 vol.% spherical U–2 wt.% Mo and U–10 wt.% Mo powders in an...