Transient Liquid Phase Bonding (2005)
Bobzin, K., Bosse, L., Brandenburg, A., Dilthey, U., Erdle, A., Ferrara, S., ...
Laser applications in microtechnology (2005)
Gillner, A., Holtkamp, J., Hartmann, C., Olowinsky, A., Gedicke, J., Klages, K., ...
The production and machining of micro parts were in the past mainly made by technologies developed from the electronic industry, which is particularly based on silicon etching technologies for the...
Smolka, G., Gillner, A., Bosse, L., Lützeler, R.
Besides their high rating in macro-range industrial manufacturing processes, beam joining methods are also increasingly gaining in importance in the micro-system technology (MST). While the industry...
Laser beam micro forming as a new adjustment technology using dedicated actuator structures (2003)
The increasing demands in MEMS fabrication in the past led to new requirements in production technology for these devices. Especially the packaging and assembly of optical devices like high power...
Laser beam soldering: an attractive alternative to conventional soldering technologies (2003)
Bosse, L., Koglin, A., Olowinsky, A.M., Kolauch, V., Nover, M.
Laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology today. Due to the actual trend towards complex and cost intensive products,...
High quality laser beam soldering (2002)
Bosse, L., Schildecker, A., Gillner, A., Poprawe, R.
In the work presented the potential of a pyrometric process control during laser beam soldering will be enhanced. Primarily we have developed a processing head with an integrated up-to-date...
Adapted time-power-profile for laser beam soldering with solder paste (2001)
Bosse, L., Gillner, A., Poprawe, R.
Today laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology. However due to the onwardly going miniaturisation and the world-wide...
High quality laserbeam soldering (2001)
Bosse, L., Schildecker, A., Gillner, A., Poprawe, R.
Due to the increasing integration and miniaturisation of microelectronic circuits laser radiation is a suitable tool for joining in microfabrication, which has the advantages of a controlled local...
Henning, T., Bosse, L., Büchel, U., Olowinsky, A., Poprawe, R.
Faserlaser gewinnen aufgrund ihrer steigenden Ausgangsleistungen zunehmend an Bedeutung für die Mikrobearbeitung. Voraussetzung für den effektiven Einsatz eines Faserlasers ist allerdings ein...
Laser beam micro joining for electronics industry (2000)
Olowinsky, A., Legewie, F., Kramer, T., Bosse, L., Gillner, A., Poprawe, R.
Diodenlasersystem mit verstellbarer Leistungsdichteverteilung (1999)
Drenker, A., Bosse, L., Hänsch, D., Schürmann, B., Pütz, H., Treusch, H.G., ...
This paper reports the main results of a research project dealing with the development of a new diode laser system whose intensity distribution can be controlled spatially resolved. In the first part...