L. Juschkin

Details der Publikationsliste

Zeitraum

2001 - 2009

Anzahl

10

Co-Autoren

Line image sensors for spectroscopic applications in the extreme ultraviolet (2009)

Banyay, M., Brose, S., Juschkin, L.

The spectral range of extreme ultraviolet radiation (XUV or EUV) is an active area of research incorporating many scientific fields such as microscopy, lithography or reflectometry. During the last...

Mit weicher Röntgenstrahlung hochgenau messen: Weiche Röntgenstrahlung fur Anwendungen innerhalb der Materialwissenschaften und der Oberflächenmesstechnik (2007)

Schmitt, R., Damm, B.E., Juschkin, L.

Bildgebende Verfahren zur Messung und Prüfung unterschiedlicher Objektmerkmale sind durch eine hohe Flexibilität gekennzeichnet. Neben herkömmlichen Prüfverfahren, die auf sichtbarem Licht oder...

Vorrichtung und Verfahren fuer die XUV-Mikroskopie (2007)

Juschkin, L., Bergmann, K., Neff, W.

DE 102007041939 A1 UPAB: 20090323 NOVELTY - The optical imaging system, for extreme UV (XUV) microscopy, has an initial enlargement stage (1',1') giving an intermediate image (5) of at least part of...

Fundamentals and limits for the EUV emission of pinch plasma sources for EUV lithography (2004)

Krücken, T., Bergmann, K., Juschkin, L., Lebert, R.

Future extreme ultraviolet (EUV) lithography will require high radiation intensities at a wavelength around 13.5 nm. The limits of emission in this spectral range from discharge based plasmas are...

Extreme ultraviolet radiation from pulsed discharges: A new access to "nanoscopy" and "nanolytics" (2004)

Lebert, R., Wies, C., Juschkin, L., Jägle, B., Neff, W., Barthel, J., ...

Both, microscopic and analytic techniques using light (IR, VIS, UV) or X-rays reach their limits when dealing with mesoscopic or nanoscale samples. Conventional instrumentation for nanotechnology do...

Pinch plasma radiation sources for the extreme ultraviolet (2001)

Neff, W., Bergmann, K., Rosier, O., Lebert, R., Juschkin, L.

Extreme ultraviolet lithography (EUVL) is under discussion to be implemented in the production of chips as early as 2005 to 2007 for reducing structures in semiconductor devices to below 70 mn. The...