Weinreich, W., Wilde, L., Kücher, P., Lemberger, M., Yanev, V., Rommel, M., ...
Tunneling atomic force microscopy \'01TUNA\'02 is used to identify leakage current characteristics in SiO2 doped ZrO2 thin films within the nanometer scale. TUNA current maps and local TUNA I-V...
Improved manufacturability of ZrO2 MIM capacitors by process stabilizing HfO2 addition (2009)
Müller, J., Böscke, T.S., Schröder, U., Reinicke, M., Oberbeck, L., Zhou, D., ...
A broad compositional range of the dielectric material Zr1-xHfxO2 was evaluated with respect to its applicability in DRAM storage capacitors. The paper reports on phase composition, crystallization...
Weinreich, W., Reiche, R., Lemberger, M., Jegert, G., Müller, J., Wilde, L., ...
Polarity asymmetries in JSV and CSV characteristics of symmetrical MIM capacitors with amorphous and crystalline Zr(1\'02x)AlxO2 films and TiN electrodes are evaluated. Physical analysis of the...
Weinreich, W., Ignatova, V.A., Wilde, L., Teichert, S., Lemberger, M., Bauer, A.J., ...
The influence of the annealing atmosphere and temperature on the crystalline phase and composition of thin ZrO2 layers grown by atomic layer deposition on silicon is analyzed. These physical...
Paskaleva, A., Yanev, V., Rommel, M., Lemberger, M., Bauer, A.J.
In this work, tunneling atomic force microscopy (TUNA) is used to describe the charge trapping in high-k ZrO2 dielectric stacks at nanoscale dimensions by analyzing the alteration of the I-V curves...
HfSiO/SiO2- and SiO2/HfSiO/SiO2-gate stacks for non-volatile memories (2008)
Erlbacher, T., Jank, M.P.M., Lemberger, M., Bauer, A.J., Ryssel, H.
The use of hafnium silicate (HfSiO) as a charge trapping layer in charge-based non-volatile memory cells will be discussed. First, fundamental properties (e.g., dielectric constant, trap...
HfSiO/SiO2- and SiO2/HfSiO/SiO2-gate stacks for non-volatile memories (2008)
Erlbacher, T., Jank, M.P.M., Lemberger, M., Bauer, A.J., Ryssel, H.
The use of hafnium silicate (HfSiO) as a charge trapping layer in charge-based non-volatile memory cells will be discussed. First, fundamental properties (e.g., dielectric constant, trap...
Yanev, V., Rommel, M., Lemberger, M., Petersen, S., Amon, B., Erlbacher, T., ...
High-k dielectric layers (HfSixOy and ZrO2) with different film morphologies were investigated by tunneling atomic-force microscopy (TUNA). Different current distributions were observed for amorphous...
Baunemann, A., Lemberger, M., Bauer, A.J., Parala, H., Fischer, R.A.
Three different all nitrogen-coordinated heteroleptic precursors, [Ta(NEtMe)3(N-tBu)] (1), [Ta(NEtMe)(N-tBu){C(N-iPr)2-(NEtMe)}2] (2), and [Ta(NMeEt)2(N-tBu)(tdmh)] (3) (Et = ethyl, Me = methyl, tBu...
Lemberger, M., Schön, F., Dirnecker, T., Jank, M.P.M., Frey, L., Ryssel, H., ...
In this work, hafnium silicate layers on Si and Ge wafers for gate dielectric application in metal-oxide-semiconductor devices are investigated. Films are deposited by metal-organic (MO)CVD using the...
Lemberger, M., Thiemann, S., Baunemann, A., Parala, H., Fischer, R.A., Hinz, J., ...
Tantalum nitride films obtained by MOCVD using a tert-butylimido-tris-ethylmethylamido-tantalum (TBTEMT, Ta(NCMe3)(NEtMe)(3)) compound were physically and electrically investigated. Lowest...
Paskaleva, A., Atanassova, E., Lemberger, M., Bauer, A.J.
Results on leakage currents and conduction mechanisms in various high-k dielectric layers (Zr-, Hf-, HfTi-silicates and Ta2O5) are presented. It is demonstrated that small alteration of the...
MOCVD of conductive cubic HfN thin films from Hf(NR2)4 and N,N-dimethylhydrazine (2005)
Kim, Y., Parala, H., Bauer, A.J., Lemberger, M., Baunemann, A., Fischer, R.A.
Rommel, M., Groß, M., Ettinger, A., Lemberger, M., Bauer, A.J., Frey, L., ...
In this work, silicon insulator interfaces are characterized by detailed photocurrent analysis. Results obtained for a variety of samples with different insulator layers and layer thicknesses are...
MOCVD of cunductive cubic HfN thin films from Hf(NR2)4 and N,N-dimethylhydrazine (2005)
Kim, Y., Parala, H., Bauer, A.J., Lemberger, M., Baunemann, A., Fischer, R.A.
Electrical properties of hafnium silicate films obtained from a single-source MOCVD precursor (2005)
Lemberger, M., Paskaleva, A., Zurcher, S., Bauer, A.J., Frey, L., Ryssel, H.
Paskaleva, A., Bauer, A.J., Lemberger, M., Zurcher, S.
We have investigated the electrical behavior of high permittivity (high-k) hafnium-titanium-silicate (HfxTiySizO) layers with different Hf:Ti ratios in the films. The films are prepared by...
Electrical characterization of zirconium silicate films obtained from novel MOCVD precursors (2003)
Lemberger, M., Paskaleva, A., Zürcher, S., Bauer, A.J., Frey, L., Ryssel, H.
Zirconium silicate films obtained from novel MOCVD precursors (2003)
Lemberger, M., Paskaleva, A., Zürcher, S., Bauer, A.J., Frey, L., Ryssel, H.
Zürcher, S., Morstein, M., Spencer, N.D., Lemberger, M., Bauer, A.
Two new single-source zirconium silicate precursors Zr(acac)(2)(OSiMe3)(2) A, and Zr(acac)(2)((OSiBuMe2)-Bu-t)2 B, have been synthesized. The stability and vapor pressure of the two compounds were...
Jank, M.P.M., Lemberger, M., Frey, L., Ryssel, H.
For characterization of oxide damage created by through the gate implantation (TGI) of boron, we prepared samples that allowed us to investigate reliability degradation and intrinsic electron trap...