3D packaging for space application : imagination and reality (2005)
Monfraix, Philippe, Drevon, C., Schaffauser, Chloé, Paillard, Mathieu, Vendier, Olivier, Cazaux, Jean-Louis
This paper describes theALCATELexperience on the design, manufacturingandmeasurementof microwave and digital modules based on 3D packagingapproach.Even if that appears as a very futuristic...
New Trends for Microwave Packaging into Space-Borne Equipment (2002)
Drevon, C., Monfraix, Philippe, Paillard, Mathieu, Schaffauser, Chloé, Vendier, Olivier, Cazaux, Jean-Louis
This paper focuses on the most promising evolutions which are emerging in the packaging of microwave functions for space applications. Starting from the former micropackage solution, continuing with...