3D packaging for space application : imagination and reality (2005)
Monfraix, Philippe, Drevon, C., Schaffauser, Chloé, Paillard, Mathieu, Vendier, Olivier, Cazaux, Jean-Louis
This paper describes theALCATELexperience on the design, manufacturingandmeasurementof microwave and digital modules based on 3D packagingapproach.Even if that appears as a very futuristic...
New Trends for Microwave Packaging into Space-Borne Equipment (2002)
Drevon, C., Monfraix, Philippe, Paillard, Mathieu, Schaffauser, Chloé, Vendier, Olivier, Cazaux, Jean-Louis
This paper focuses on the most promising evolutions which are emerging in the packaging of microwave functions for space applications. Starting from the former micropackage solution, continuing with...
3D active modules for high integration active antennas (1998)
Ulian, Patrice, Monfraix, Philippe, George, Sebastien, Tronche, Christian, Drevon, C., Cazaux, Jean-Louis
This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly...