Highly reliable and extremely stable SiGe micro-mirrors (2007)
Haspeslagh, Luc, Verbist, Agnes, Du Bois, Bert, Van Hoof, Rita, Eyckens, Brenda, ...
Thermal modeling and management in ultrathin chip stack technology (2002)
Pinel, Stèphane, Marty, Antoine, Tasselli, Josiane, Bailbe, Jean-Pierre, Beyne, Eric, Van Hoof, Rita, ...
This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process. Besides the high concentration of power dissipating sources, which is the...
Residual thermomechanical stresses in thinned-chip assemblies (2000)
Leseduarte Cuevas, Sergio, Marco Colás, Santiago, Beyne, Eric, Van Hoof, Rita, Marty, Antoine, Pinel, Stèphane, ...
A new technology for the three-dimensional (3-D) stacking of very thin chips on a substrate is currently under development within the ultrathin chip stacking (UTCS) Esprit Project 24910. In this...