Gómez Cama, José Ma., Bota Ferragut, Sebastián Antonio, Marco Colás, Santiago, Samitier I Martí, Josep
Palacín Roca, Jordi, Salleras, Marc, Samitier I Martí, Josep, Marco Colás, Santiago
Whereas numerical modeling using finite-element methods (FEM) can provide transient temperature distribution in the component with enough accuracy, it is of the most importance the development of...
Perera I Lluna, Alexandre, Papamichail, Niko, Barsan, Nicolae, Weimar, Udo, Marco Colás, Santiago
Leakage detection is an important issue in many chemical sensing applications. Leakage detection hy thresholds suffers from important drawbacks when sensors have serious drifts or they are affected...
Thermal modeling and management in ultrathin chip stack technology (2002)
Pinel, Stèphane, Marty, Antoine, Tasselli, Josiane, Bailbe, Jean-Pierre, Beyne, Eric, Van Hoof, Rita, ...
This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process. Besides the high concentration of power dissipating sources, which is the...
Palacín Roca, Jordi, Marco Colás, Santiago, Samitier I Martí, Josep
Multiexponential decays may contain time-constants differing in several orders of magnitudes. In such cases, uniform sampling results in very long records featuring a high degree of oversampling at...
Improved multiexponential transient spectroscopy by iterative deconvolution (2001)
Marco Colás, Santiago, Palacín Roca, Jordi, Samitier I Martí, Josep
The analysis of multiexponential decays is challenging because of their complex nature. When analyzing these signals, not only the parameters, but also the orders of the models, have to be estimated....
Residual thermomechanical stresses in thinned-chip assemblies (2000)
Leseduarte Cuevas, Sergio, Marco Colás, Santiago, Beyne, Eric, Van Hoof, Rita, Marty, Antoine, Pinel, Stèphane, ...
A new technology for the three-dimensional (3-D) stacking of very thin chips on a substrate is currently under development within the ultrathin chip stacking (UTCS) Esprit Project 24910. In this...
Carmona, Manuel, Marco Colás, Santiago, Palacín Roca, Jordi, Samitier I Martí, Josep
The study of the thermal behavior of complex packages as multichip modules (MCM¿s) is usually carried out by measuring the so-called thermal impedance response, that is: the transient temperature...
Marco Colás, Santiago, Ortega Mansilla, Arturo, Pardo Martínez, Antonio, Samitier I Martí, Josep
Low-cost tin oxide gas sensors are inherently nonspecific. In addition, they have several undesirable characteristics such as slow response, nonlinearities, and long-term drifts. This paper shows...
Pardo Martínez, Antonio, Marco Colás, Santiago, Samitier I Martí, Josep
Gas sensing systems based on low-cost chemical sensor arrays are gaining interest for the analysis of multicomponent gas mixtures. These sensors show different problems, e.g., nonlinearities and slow...
RESUMEN: Dentro del amplísimo campo de los sensores, están emergiendo con gran fuerza los dispositivos basados en tecnología de silicio. El uso de la tecnología microelectrónica para la...