High-frequency gratings for applications to microoptical ellipsometer/polarimeter systems (2009)
Dias, D., Stankovic, S., Hain, M., Tschudi, T., Rauch, T., Drews, D., ...
We report on experimental results which we conducted on manufactured microretarder arrays. The array consists of miniaturized retarder elements with different orientations of their fast axes....
Projection maskless lithography (PML2): Proof-of-concept setup and first experimental results (2008)
Klein, C., Platzgummer, E., Loeschner, H., Gross, G., Dolezel, P., Tmej, M., ...
Projection Mask-Less Lithography (PML2) is a potentially cost-effective multi electron-beam solution for the 32nm-node and beyond. PML2 is targeted on using hundreds of thousands of individually...
MAGIC: A european program to push the insertion of maskless lithography (2008)
Pain, L., Icard, B., Tedesco, S., Kampherbeck, B., Gross, G., Klein, C., ...
Impact of Si DRIE on vibratory MEMS gyroscope performance (2007)
Merz, P., Pilz, W., Senger, F., Reimer, K., Grouchko, M., Pandhumpsoporn, T., ...
Bekris, N., Skinner, C.H., Berndt, U., Gentile, C.A., Glugla, M., Erbe, A., ...
11th Internat.Conf.on Fusion Reactor Materials, Kyoto, J, December 7-12, 2003
A small and compact AMS facility for tritium depth profiling . (2004)
Friedrich, M., Pilz, W., Bekris, N., Glugla, M., Kiisk, M., Liechtenstein, V.
Proc. of the 9. Int. Conf. on Accelerator Mass Spectrometry, Nagoya, J, September 9-13, 2002
A small and compact AMS facility for tritium depth profiling. (2003)
Friedrich, M., Pilz, W., Bekris, N., Glugla, M., Kiisk, M., Liechtenstein, V.
PRAMANA : Journal of Physics, 59(2002) S.1053-59
Tritium depth profiles and accelerator mass spectroscopy for JET tiles (graphite/CFC tiles). (2003)
Bekris, N., Glugla, M., Berndt, U., Penzhorn, R.D., Friedrich, M., Pilz, W.
Watanabe, K. [Hrsg.]
Tritium in plasma facing components. (2002)
Penzhorn, R.D., Coad, J.P., Bekris, N., Doerr, L., Friedrich, M., Pilz, W.
21st Symp.on Fusion Technology (SOFT), Madrid, E, September 11-15, 2000
Steingrüber, R., Ferstl, M., Pilz, W.
The fabrication of micro-optical elements by electron-beam lithography and dry etching technique using a top conductive coating is presented. This conductive layer prevents the occurrence of charging...
Vorrichtung zur Oberflaechenbearbeitung wenigstens eines flaechig ausgebildeten Substrates (2001)
Equipment for the surface treatment of at least one flat substrate (3) coated on one side with an electrically non-conducting layer (3a), the other side being the surface to be processed, with a flat...
Tritium Depth Profiling by AMS in Carbon Samples from Fusion Experiments (2001)
Friedrich, M., Pilz, W., Sun, G. Y., Penzhorn, R.-D., Bekris, N., Behrisch, R., ...
Tritium depth profiling by AMS in carbon samples from fusion experiments. (2001)
Friedrich, M., Pilz, W., Sun, G., Penzhorn, R.D., Bekris, N., Behrisch, R., ...
Proc.of the 5th Internat.Workshop on Hydrogen Isotopes in Solids, Stockholm, S, May 17-19, 2000
Tritium Depth Profiling in Carbon by Accelerator Mass Spectrometry (2000)
Friedrich, M., Pilz, W., Sun, G.Y., Behrisch, R., García-Rosales, C., Bekris, N., ...
Tritium depth profiling in carbon by accelerator mass spectrometry. (2000)
Friedrich, M., Pilz, W., Sun, G., Behrisch, R., Garcia-Rosales, C., Bekris, N., ...
Proc.of the 14th Internat.Conf.on Ion Beam Analysis (IBA-14), Dresden, July 26-30, 1999
Tritium depth profiling in carbon samples from fusion experiments. (2000)
Friedrich, M., Pilz, W., Sun, G., Behrisch, R., Garcia-Rosales, C., Penzhorn, R.D., ...
AMS-8 (AMS = Accelerator Mass Spectrometry), Wien, A, September 6-10, 1999
Influence of deposition and etching on high aspect ratio patterning (1997)
Hoffmann, P., Pilz, W., Janes, J., Huth, C., Börnig, K., Peters, S.
The tailoring of a dry etching process in order to fulfill all requirements in a high yield, low cost production becomes increasingly ambitious. Stringent specifications on plasma induced damage,...
Fabrication of microrelief surfaces using a one-step lithography process (1997)
Reimer, K., Hofmann, U., Jürss, M., Pilz, W., Quenzer, H.J., Wagner, B.
Erzeugung von Mikrorelief-Oberflächen mit Grauton-Lithographie (1997)
Wagner, B., Reimer, K., Hofmann, U., Quenzer, H.J., Jürss, M., Pilz, W.
Die Grauton-Lithographie ist eine Technologie zur Herstellung von freiwählbaren kontinuierlichen Reliefoberflächen mit Dimensionen im Mikrometerbereich. Das Verfahren kommt mit einem einzigen...
One-level gray-tone design. Mask data preparation and pattern transfer (1996)
Reimer, K., Henke, W., Quenzer, H.J., Pilz, W., Wagner, B.
One-level gray-tone lithography, in spite of using a common mask technique and CMOS equipment, has quite different demands on data preparation and wafer processing. This paper reports on algorithms...
Fabrication of relief-topographic surfaces with one-step UV-lithographic (1995)
Quenzer, H.J., Henke, W., Hoppe, W., Pilz, W., Reimer, K., Wagner, B.
Sub-mym HTSL-Strukturierung mit additiven und subtraktiven Methoden (1993)
Grändorff, K., Gulde, P., Janes, J., Marschner, M., Pilz, W.
Patterning of thin HTSC films - evaluation of lithography and dry etching (1992)
Pilz, W., Grändorff, K., Stoll, H.-P., Janes, J.
Novel surface imaging process with ion-beam lithography and dry development (1992)
Jadghold, U.A., Buchmann, L.-M., Pilz, W., Torkler, M.
Oxygen reactive ion etching of polymers-profile evolution and process mechanisms (1991)
Janes, J., Pelka, J., Pilz, W.
Multi-level masking techniques are increasingly employed in lithographic schemes, especially when sub-micron size features are to be defined. The capability to planarise topography before critical...
Profile evolution in the multilevel technique (1990)
The oxygen reactive ion etching of sub-half micron features in organic layers produces a variety of profile effects depending on both system parameters and pattern arrangements. Vertical and lateral...
Advanced 200 nm gate profile fabrication with reactive ion etching (1990)
Pilz, W., Belle, G., Franosch, M., Hübner, H.-P.
A processing sequence for the fabrication of Y-shaped profiles for HEMTs and MESFETs using electron beam lithography (EBL) and reactive ion etching (RIE) will be presented. On the top of a tri-layer...
Parametric studies of SF6 silicon etching in a 200 mm RIE system (1989)
Hoffmann, P., Heinrich, F., Pilz, W.
Investigations on SF sub 6 plasmas at variation of the machine parameters, substrate composition and additional reactor components are presented. Correlations between process performance, plasma...
Performance of an 8" RIE etching system - the effect of cathode cover mateials (1988)
Hoffmann, P., Heinrich, F., Pilz, W., Scheer, H.-C., Hussla, I., Cairns, J., ...
Within the project "High Resolution Plasma Etching in Semiconductor Technology - Fundamentals, Processing, Equipment", a new and versatile 8" 3-chamber single wafer RIE etching system has been...
Pilz, W., Scheer, H.-C., Hussla, I., Banks, P.
The second phase development of the multi-chamber plasma etching system MPE 3003 is described herein. After a brief review of the design criteria presented last year, we now describe the full...
Critical dimension control in x-ray masks with electroplated gold absorbers (1986)
Windbracke, W., Betz, H., Huber, H.-L., Pilz, W., Pongratz, S.
This paper describes a multi-layer technique for e-beam written x-ray master masks with electroplated gold absorbers, which allows to fulfill the demands on controlling linewidth of 0.5 Mikrometer...
Submicron patterns formed by reactive ion etching (1985)
Pilz, W., Sponholz, T., Pongratz, S., Mader, H.
A tri-level etching process based on polyimide as bottom layer, silicon nitride as intermediate layer, and PMMA resist as top layer is presented. The reactive ion etch process allows the transfer of...
SIMS and AES investigations of contamination effects by RIE of PIQ layers (1985)
Rangelow, J.W., Masseli, K., Niewoehner, L., Kassing, R., Pilz, W.
In a tri-level process PIQ layers on top of silicon have been dry etched with oxygen using different techniques: reactive ion etching (RIE) in a so-called HEX-reactor, reactive ion beam etching...