Pica: A MIMD Architecture for Multi-Node Chip Implementation (2007)
VLSI technology continues to improve chip density, size, and speed. In the near future, multi-node chips will offer the only avenue to efficiently harness these increasing resources. Limited off-chip...
W. Stephen Lacy, Ieee Computer Society, D. Scott Wills, Senior Member
Abstract—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconnect has...
Processing Architectures for Smart Pixel Systems (1996)
Scott Wills, James M. Baker, Huy H. Cat, Sek Chai, Jos� Cruz-rivera, John Eble, ...
Smart pixel architectures offer important new opportunities for low cost, portable image processing systems. They provide greater I/O bandwidth and computing performance than systems based on CCD and...
A ThreeDimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect (1995)
D. Scott Wills, W. Stephen Lacy, Christophe Camperi-ginestet, Brent Buchanan, Huy H. Cat, Scott Wilkinson, ...
Abstract-This paper presents a three-dimensional, highly par-allel, optically interconnected system to process high-throughput stream data such as images. The vertical optical interconnections are...
The Offset Cube: An Optoelectronic Interconnection Network (1994)
Scott Wills, W. Stephen Lacy, Jose Cruz-rivera
. This paper introduces a new network topology, the offsetcube, for three-dimensional image processing systems. It provides general node-to-node communications for random message traffic with an...
High-Throughput, Low-Memory Applications on the Pica Architecture (1994)
D. Scott Wills, Huy H. Cat, José Cruz-rivera, W. Stephen Lacy, James M. Baker, John C. Eble, ...
Abstract—This paper describes Pica, a fine-grain, message-passing architecture designed to efficiently support high-throughput, low-memory parallel applications, such as image processing, object...
Pica: An Ultra-Light Processor for High-Throughput Applications (1993)
D. Scott Wills, W. Stephen Lacy, Huy Cat, Michael A. Hopper, Ashutosh Razdan, Sek M. Chai
This paper introduces Pica, a fine-grain, message passing architecture designed to efficiently support high-throughput parallel applications. The architecture minimizes overhead for basic parallel...
High-Throughput, Low-Memory Applications on the Pica Architecture
Scott Wills, Huy H. Cat, Jos� Cruz-rivera, W. Stephen Lacy, James M. Baker, John Eble
This paper introduces Pica, a fine-grain, message passing architecture designed to efficiently support high-throughput parallel applications. This focus on high-throughput applications allows a small...